Honor has confirmed that the upcoming Magic 3 flagship series will be powered by the new Snapdragon 888 Plus 5G mobile platform. Honor separated from Huawei in order to maintain its relations with US companies. So, this is a huge step. This series is expected to become a flagship series of Honor and will surely compete in the already competitive market.
Christopher Patrick, senior vice president, and general manager, mobile handset business, Qualcomm Technologies, Inc. quoted, “Snapdragon is synonymous with premium Android experiences. Our latest flagship Snapdragon 888 Plus 5G Mobile Platform will help deliver the premium entertainment, connectivity, and gaming experiences users deserve. We are excited to see OEMs launch with products based on our highest performing platform”.
This new chipset will bring improvement in performance as compared to its predecessors in respect to both processing and AI performance.
It is also the rumor that at least one Magic 3 smartphone may be a foldable one. Though, it is only guesswork as no Magic 3 device has leaked so far. The new series is still expected to be more powerful than its predecessors even though the improvement is not drastic.
Fang Fei, president of the product line, HONOR Device co. ltd. Said, “We’re delighted to see the collaboration between HONOR and Qualcomm Technologies take another step forward. The game-changing advancements we see in the new Snapdragon 888 Plus 5G Mobile Platform make it a perfect fit for HONOR’s upcoming Magic 3 series flagship.
